Insight for soldering problem

Aug 07, 2011 17:27

Last night i awoke in the middle of the night with a solution to one of my current soldering problems: the inlay. It is pretty much impossible to place solder chips along the length of metal, since the flux bubbles them off when heated; it is a PITA to bend them and insert them in the seam so they're positioned and kinda stuck when the heat hits ( Read more... )

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Comments 3

metalrabbit August 7 2011, 22:06:29 UTC
Would auflux work - doesn't bubble up as much? or balls?

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afmetalsmith August 7 2011, 22:21:14 UTC
Thanks for the suggestions!

Yes, a less bubbly flux would be easier- but right now I'm doing prototypes in copper and silver, so I need a pretty sturdy flux. Once i get to gold, of course... well, I'll have to revisit everything. Sigh.

Of course, that's only if the prototypes actually WORK, and they may well not- which is why I'm using copper and silver here. :)

Balls are great, and I use them a lot! but for this one- the stick soldering seems to be effective, even though it's rather a "cowboy" technique- and one I almost never use, which is why it took me so long to think of it!

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barbarienne August 8 2011, 02:48:24 UTC
I have fallen in love with a product called Firescoff. The sales copy promises miracles...and it actually delivers. It's not cheap, but it is totally worth it.

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