Last night i awoke in the middle of the night with a solution to one of my current soldering problems: the inlay. It is pretty much impossible to place solder chips along the length of metal, since the flux bubbles them off when heated; it is a PITA to bend them and insert them in the seam so they're positioned and kinda stuck when the heat hits
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Yes, a less bubbly flux would be easier- but right now I'm doing prototypes in copper and silver, so I need a pretty sturdy flux. Once i get to gold, of course... well, I'll have to revisit everything. Sigh.
Of course, that's only if the prototypes actually WORK, and they may well not- which is why I'm using copper and silver here. :)
Balls are great, and I use them a lot! but for this one- the stick soldering seems to be effective, even though it's rather a "cowboy" technique- and one I almost never use, which is why it took me so long to think of it!
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